Patent · US Active

Structural bonding adhesive

US12187842B2 · kind B2 · utility

0Cited by

13References

17Claims

0Family size

Assignee

Zephyros, Inc. · US

Inventors

David Kosal · Richmond, US
Michael Czaplicki · Rochester, US
Yuan Lu · Xiluo, TW

Key dates

Filing date	Oct 29, 2019
Grant date	Jan 7, 2025
Priority date	—
Expiry date	Nov 3, 2040

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L2207/53
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

A material comprising an epoxy/elastomer adduct, a polymeric particle, from about 0.05 to about 20 weight percent of an epoxy/diacid adduct, and optionally, an amine reaction product.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.