Magnet system and sputtering device
US12188119B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 11, 2022 |
| Grant date | Jan 7, 2025 |
| Priority date | — |
| Expiry date | Jan 3, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/345
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Disclosed herein are systems, methods, and devices related to a magnet system for a sputtering device. The magnet system includes a bearing frame and a magnet holder having a first mounting area and a second mounting area. The magnet system has a first support device mounted to the magnet holder by the first mounting area and a second support device mounted to the magnet holder by the second mounting area. At least one of the first mounting area and the second mounting area are configured such that a position in which the first support device and the second support device are mounted to the magnet holder relative to each other may be adjusted. The first support device and the second support device are configured to engage with the bearing frame to form a bearing device for supporting the magnet holder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.