Electroplating device and electroplating system
US12188143B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jan 29, 2022 |
| Grant date | Jan 7, 2025 |
| Priority date | — |
| Expiry date | Jul 23, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D21/12
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroplating device includes an electroplating bath containing an electroplating solution into which a workpiece to be electroplated as a cathode is at least partially immersed, a first anode provided in the electroplating bath, and a liquid spraying device. The liquid spraying device includes a main body part having at least one inlet for conveying the electroplating solution into the main body part, and a plurality of nozzles installed on the main body part. At least part of the nozzles are positioned such that a flow direction of the electroplating solution ejected from the nozzle is substantially parallel to a direction of a power line formed by the first anode and the cathode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.