Heat pump adapter system
US12188697B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2020 |
| Grant date | Jan 7, 2025 |
| Priority date | — |
| Expiry date | Sep 3, 2041 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF25B2700/21175
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat pump system having a common refrigerant flow path split coupled to heating mode first and second refrigerant streams. In the common refrigerant flow path, a compressor is coupled to receive refrigerant from the heating mode first refrigerant stream and the heating mode second refrigerant stream. A refrigerant-to-refrigerant heat exchanger couples heat between the heating mode first refrigerant stream and the heating mode second refrigerant stream. A first refrigerant-air heat exchanger and a second refrigerant-air heat exchanger in a second air flow conduit is coupled to receive a first air flow from a first refrigerant-air heat exchanger in a first air flow conduit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.