Heat exchanger comprising a plate package and a hollow manifold
US12188728B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2021 |
| Grant date | Jan 7, 2025 |
| Priority date | — |
| Expiry date | Dec 23, 2041 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2255/20
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
The present invention relates to a plate heat exchanger comprising a plate package and a manifold both made of metal. The plate package comprises a plurality of heat exchanger plates stacked between end plates. The heat exchanger plates being sealed to each other and form alternating first plate interspaces for a first medium and second plate interspaces for a second medium. The plate package defines at least two port channels communicating with the first plate interspaces. At least one of the end plates define connection ports communicating with a respective port channel. The manifold defines a port opening, a distant opening and a flow passage extending between the port opening and the distant opening. The manifold being fixedly attached to one of the end plates such that the port opening of the manifold covers one of the connection ports. The manifold being made by additive manufacturing, moulding or casting.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.