Stacked filter assembly for optical integrated circuit package with an optical filter mounted to an optical integrated circuit device by a discrete semiconductor spacer block
US12189064B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2023 |
| Grant date | Jan 7, 2025 |
| Priority date | — |
| Expiry date | Apr 11, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/40
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A device includes an optical integrated circuit device mounted over an upper surface of a support substrate. The optical integrated circuit device includes an optical sensor array supported by a semiconductor substrate made of a first semiconductor material. A discrete semiconductor block, made of a second semiconductor material, is mounted over an upper surface of the optical integrated circuit device adjacent the optical sensor array. The first and second semiconductor materials have substantially matched coefficients of thermal expansion. A parallelpipedal-shaped optical filter is mounted over an upper surface of the discrete semiconductor block and extends over the optical sensor array. One or more edges/corners of the parallelpipedal-shaped optical filter cantilever over the optical sensor array without any provided support.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.