Patent · US Active

Thermal modeling for computer numerically controlled fabrication

US12189363B2 · kind B2 · utility

0Cited by
2References
18Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 27, 2020
Grant dateJan 7, 2025
Priority date
Expiry dateNov 27, 2040

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG05B2219/49023
  • WIPO fieldControl
  • WIPO sectorInstruments

Abstract

A method for computer numerically controlled processing may include receiving configurations for a fabrication in which a computer numerically controlled machine processes a material to achieve one or more designs. An analysis may be performed to determine whether a thermal event occurs during the fabrication. The analysis may include performing one or more of a time-variant simulation and a time-invariant simulation of the fabrication. The thermal event may include one or more regions of the material exhibiting an undesirable response to the electromagnetic energy delivered to the material. One or more outputs may be generated based on the result of the thermal verification. The outputs may include a visualization of the quantity of energy exposure across the material, an alert if a thermal event is determined to occur during the fabrication, and corrective actions for resolving potential thermal events.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.