Wafer transfer system and method of use
US12191165B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 15, 2021 |
| Grant date | Jan 7, 2025 |
| Priority date | — |
| Expiry date | Mar 25, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67748
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer transfer system includes a transfer chamber defining a volume. The transfer chamber includes a wafer support within the volume to support a wafer. A first input gas nozzle is disposed above the wafer support and inputs a first flow of gas into the transfer chamber at a first flow speed. A second input gas nozzle is disposed below the wafer support and inputs a second flow of gas into the transfer chamber at a second flow speed different than the first flow speed. A first output gas structure guides the gas from the transfer chamber due to the second flow speed being different than the first flow speed such that suspended particles within the transfer chamber are at least one of directed away from the wafer support or directed toward the first output gas structure to guide the suspended particles from the transfer chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.