Gas-permeable package lid of chip package structure and manufacturing method thereof
US12191219B2 · kind B2 · utility
0Cited by
15References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 19, 2022 |
| Grant date | Jan 7, 2025 |
| Priority date | — |
| Expiry date | Feb 9, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/564
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A gas-permeable package lid of a chip package structure and a manufacturing method thereof are provided. The gas-permeable package lid of the chip package structure includes a lid body, a through hole, and a hydrophobic gas-permeable membrane. The lid body is integrally formed. The through hole penetrates the lid body. The hydrophobic gas-permeable membrane is bonded to the lid body and shields the through hole. A part of the hydrophobic gas-permeable membrane is embedded in the lid body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.