Apparatus for minimizing electromagnetic coupling between surface mount device inductors
US12191932B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2022 |
| Grant date | Jan 7, 2025 |
| Priority date | — |
| Expiry date | Dec 23, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/1003
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A surface mount device inductor has a package casing sized to attenuate electromagnetic coupling between the inductor coils of the surface mount device inductors. The surface mount device inductor includes an inductor coil, an anode structure disposed over a first end of the inductor coil and a cathode structure disposed over a second end of the inductor coil opposite the first end, the cathode structure being spaced apart from the anode structure. One or both of the anode structure and the cathode structure comprise a shield portion disposed at least partially over the inductor coil to thereby reduce electromagnetic coupling between adjacent surface mount device inductors. The package casing makes the surface mount device inductors self-shielding. The surface mount device inductors can be incorporated into a radiofrequency module, and can be incorporated into a front end system of a wireless mobile device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.