Uncooled thermal imager
US12192671B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 9, 2024 |
| Grant date | Jan 7, 2025 |
| Priority date | — |
| Expiry date | Feb 9, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N2013/0092
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multispectral or thermal imager comprising a lens assembly, an array of IC chips that is arranged in a field of view of the lens assembly, and a filter assembly comprising one or more wavelength filters. The filter assembly comprises a respective wavelength filter for at least one of the three or more rows of IC chips. At least one wavelength filter is transparent in a portion of a wavelength range that passes through the lens assembly. The filter assembly is configured such that radiation of the same wavelength range passes to the rows of IC chips in the pair of non-adjacent rows, and such that the wavelength range that passes to the rows in the pair of non-adjacent rows is different from a wavelength range that passes to the one or more rows other than the pair of non-adjacent rows.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.