Circuit board
US12193152B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 21, 2021 |
| Grant date | Jan 7, 2025 |
| Priority date | — |
| Expiry date | Jan 3, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0597
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board according to an embodiment includes an insulating layer; a first circuit pattern disposed on a first surface of the insulating layer; a first solder resist disposed on the first surface of the insulating layer; and a first barrier layer including a first-first portion disposed between the first solder resist and the first circuit pattern, and a first-second portion disposed between the insulating layer and the first circuit pattern; wherein the firs-first portion of the first barrier layer includes: a first-first gold (Au) layer disposed under a lower surface of the first circuit pattern; and a first-first palladium (Pd) layer disposed under a lower surface of the first-first gold (Au) layer; wherein the first-second portion of the first barrier layer includes: a first-second gold (Au) layer disposed to surround a side surface and an upper surface of the first circuit pattern; and a first-second palladium (Pd) layer disposed to surround the first-second gold (Au) layer; and wherein the first circuit pattern is not in contact with the first solder resist and the insulating layer by the first-first portion and the first-second portion of the first barrier layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.