Electronics housing and assembly method
US12193172B2 · kind B2 · utility
0Cited by
5References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2021 |
| Grant date | Jan 7, 2025 |
| Priority date | — |
| Expiry date | Jun 28, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K5/0082
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronics housing (10) including a circuit board (3) that is through-plated via press-fit connections (5), and including guide pins (6, 7) extending through circuit board through-holes (8, 9) provided in the circuit board (3). In order to simplify the assembly of the electronics housing (10), the guide pins (6, 7) protrude from a first press-fit body (4) of at least one first press-fit connection (5), and a second press-fit body of at least one second press-fit connection is guided onto the guide pins (6, 7) of the first press-fit body (4) on a side of the circuit board (3) facing away from the first press-fit body (4).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.