Gold finger type fan frame and double-layer connection structure thereof
US12193186B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 13, 2023 |
| Grant date | Jan 7, 2025 |
| Priority date | — |
| Expiry date | Sep 21, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02K2211/03
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
Disclosed are a gold finger type fan frame and a double-layer connection structure thereof. The gold finger type fan frame includes a first frame body, a first circuit board embedded in the first frame body, and an outlet body embedded in a side of the first frame body and detachably connected to the first circuit board, where the first circuit board includes a board body and a gold finger block, and the outlet body includes a connection block, a rear plastic housing, and a wire. According to the present disclosure, the gold finger block is inserted into the outlet body, such that rapid assembly is achieved, automatic assembly on the circuit board is facilitated, and convenience of assembly is improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.