Method of applying filament adhesive
US12194493B2 · kind B2 · utility
0Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2020 |
| Grant date | Jan 14, 2025 |
| Priority date | — |
| Expiry date | Oct 26, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2105/0097
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Provided are methods and systems for dispensing filament adhesive onto a target substrate. A filament adhesive is applied on a target substrate according to a bead application plan, then the applied bead is checked against performance criteria. A second bead application plan is generated, and subsequent filament bead applied according to the second bead application plan.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.