System and method for cleaning a laser cut substrate
US12194509B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 4, 2019 |
| Grant date | Jan 14, 2025 |
| Priority date | — |
| Expiry date | Nov 1, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/38
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A system for cleaning a surface of a substrate includes a cleaning element including a resilient compressible material. A liquid source provides liquid directly to the cleaning element, and a squeezing roller engages the cleaning element and applies pressure thereto, to squeeze out excess liquid from said resilient compressible material. A counter element opposes said cleaning element such that the substrate is disposed between the counter element and the cleaning element. The substrate moves between the counter element and the cleaning element such that a surface of the cleaning element, having a suitable amount of liquid absorbed therein, engages and cleans the surface of the substrate without damaging the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.