Patent · US Active

Method, device and computer program for producing a weakening line in a surface of a component

US12194568B2 · kind B2 · utility

0Cited by

1References

18Claims

0Family size

Assignee

Jenoptik Automatisierungstechnik GmbH · DE

Inventors

Andreas BODE-MOSIG · Jena, DE
Frank Seidel · Schnaittenbach, DE

Key dates

Filing date	Nov 22, 2021
Grant date	Jan 14, 2025
Priority date	—
Expiry date	Nov 22, 2041

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K2103/42
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A method for producing a weakening line in a surface of a component. The method comprises a guiding step and a skipping step. In the guiding step, a removal apparatus for removing a material of the surface is guided over a plurality of segments of a predefined line-shaped contour by means of an activated laser beam in order to produce a desired wall thickness for at least one of the segments so as to produce the weakening line. In the skipping step, the segment is skipped if the segment has the desired wall thickness.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.