Variable-step-distance micro-milling repair cutter path generating method for damage points on surface of optical crystal
US12194657B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 12, 2021 |
| Grant date | Jan 14, 2025 |
| Priority date | — |
| Expiry date | Jan 11, 2044 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23C2265/08
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A variable-step-distance micro-milling repair cutter path generating method for damage points on a surface of an optical crystal related to a field of optical material and optical element surface repair and includes steps of establishing a mathematical model of a repair profile; determining discrete contact points between a cutter and the repair profile to obtain a cutter contact control point set by a GPR path generating method to control a movement trend of a pseudo-random path; interpolating the cutter position control point set into a spatial curve by a NURBS modeling method; creating a UG curve in a UG software according to the mathematical model, and using the UG curve as the repair path to perform a machining process simulation. The method has good elimination effects on cutter marks with constant period and improves the ability of the KDP crystal to resist strong laser damage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.