Method for producing a plurality of sensor devices, and sensor device

US12195330B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Daniel Haug · Neuffen, DE
• Michael Knauss · Pfullingen, DE
• Sebastian Schuler-Watkins · Herrenberg, DE
• Stefan Pinter · Reutlingen, DE
• Tobias Henn · Stuttgart, DE
• Raschid Baraki · Reutlingen, DE

Key dates

• Filing date: Jan 24, 2020
• Grant date: Jan 14, 2025
• Expiry date: Oct 26, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/73265
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A method for producing a plurality of sensor devices. The method includes: furnishing a substrate having contact points in a plurality of predetermined regions for sensor chips; disposing the sensor chips in the predetermined regions on the substrate, and electrically contacting the sensor chips to the contact points; attaching a frame structure with an adhesive material on the substrate and between the sensor chips, the frame structure proceeding laterally around the sensor chips, the frame structure extending, after attachment, vertically beyond the sensor chips and forming a respective cavity for at least one of the sensor chips, and a membrane spanning at least one of the cavities for the sensor chips so as to cover it; and singulating the substrate, or the frame structure and the substrate, around the respective cavities into several sensor devices.