Forming and bonding of glass components for portable electronic devices
US12195379B2 · kind B2 · utility
0Cited by
115References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2021 |
| Grant date | Jan 14, 2025 |
| Priority date | — |
| Expiry date | Oct 12, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03B2215/406
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Techniques for making glass components for electronic devices are disclosed. The techniques disclosed herein can be used to modify a glass workpiece to form a three-dimensional glass component, such as a glass cover member. The techniques may involve reshaping the glass workpiece, fusing glass layers of the workpiece, or combinations of these. Glass components and electronic devices including these components are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.