Backing for adhesive tape with thermal resistance
US12195652B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 8, 2021 |
| Grant date | Jan 14, 2025 |
| Priority date | — |
| Expiry date | Nov 8, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2848
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Backing films for adhesive tapes are presented, as well as adhesive tapes comprising such backing films, which may include tapes used in construction such as seam sealing tapes, roofing tapes, and flashing tapes. The backing film comprises a core layer, a first skin layer, and optionally a second skin layer, where the backing film has a coefficient of thermal expansion of less than 90 ppm/° C. measured in at least one direction within the plane of the film, and, in some embodiments, a Young's modulus of less than 550 MPa as measured in at least one direction. In some embodiments, the backing film has a coefficient of thermal expansion of not more than 91.8 ppm/° C. and a Young's modulus of not more than 540 MPa as measured in any direction within the plane of the film. In some embodiments, the core layer comprises a polyolefin, and skin layers comprise a thermoplastic elastomer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.