Material scheduling method and device of semiconductor processing equipment
US12197195B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2022 |
| Grant date | Jan 14, 2025 |
| Priority date | — |
| Expiry date | Mar 28, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
Embodiments of the present disclosure provide a material scheduling method and a material scheduling device for semiconductor processing equipment. The method includes establishing a material list, establishing a first scheduling task list according to process recipes and the material list, and inputting the first scheduling task list into a solver to calculate and output a scheduling result with shortest time for performing all material scheduling tasks in the first scheduling task list and parsing the scheduling result to obtain a movement sequence of all materials. In the technical solutions of the material scheduling method and the material scheduling device for the semiconductor processing equipment of embodiments of the present disclosure, the overall scheduling result can be improved, and the calculation speed can be improved. Thus, the scheduling result can be obtained in real-time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.