Patent · US Active

Low toughness workpiece cutting apparatus, low toughness workpiece manufacturing method and recording medium storing low toughness workpiece manufacturing program

US12197197B2 · kind B2 · utility

0Cited by
4References
14Claims
0Family size

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Key dates

Filing dateJan 15, 2021
Grant dateJan 14, 2025
Priority date
Expiry dateJan 10, 2042

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG05B2219/32234
  • WIPO fieldControl
  • WIPO sectorInstruments

Abstract

A low toughness workpiece cutting apparatus, a low toughness workpiece manufacturing method and a low toughness workpiece manufacturing program for predicting an occurrence of defect and/or non-occurrence of defect before a cutting process of low toughness material. A defect prediction device is provided with a storage device, a processor and an interface. The storage device stores tool data that represent physical characteristics and a shape of a tool, cutting data that represent a group of parameters of a cutting process to be performed to a workpiece by use of the tool and material data that represent physical characteristics and a shape of the workpiece. The processor performs an analysis of deformation of the workpiece due to a cutting force and an analysis of fracture due to the deformation, and performs a prediction of an occurrence of defect and/or a non-occurrence of defect of the workpiece due to the cutting process.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.