Electrostatic chuck and substrate fixing device
US12198968B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2022 |
| Grant date | Jan 14, 2025 |
| Priority date | — |
| Expiry date | Feb 22, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/2007
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The electrostatic chuck includes an insulating substrate having a placement surface on which a suction target object is placed and an opposite surface provided on an opposite side to the placement surface; and a gas hole penetrating from the opposite surface to the placement surface. The gas hole has a first hole portion extending from the opposite surface toward the placement surface, a second hole portion extending from the placement surface toward the opposite surface, and a third hole portion provided between the first hole portion and the second hole portion and formed to communicate the first hole portion and the second hole portion each other. The first hole portion is provided not to overlap with the second hole portion in a plan view.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.