Process chamber
US12198972B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 21, 2022 |
| Grant date | Jan 14, 2025 |
| Priority date | — |
| Expiry date | Oct 21, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68792
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process chamber in a semiconductor process device includes a cavity and a base disposed in the cavity. The base includes a base body and a support column fixedly disposed at the bottom of the base body. An interior of the support column includes a receiving hole that penetrates the support column in an axial direction of the support column. A fixed through-hole is formed at the bottom of the cavity. A bottom end of the support column is fixedly arranged in the fixed through-hole. The receiving hole is connected to the outside of the process chamber through the fixed through-hole. The fixed through-hole includes a positioning groove formed on the bottom wall of the cavity and a connection hole penetrating from the bottom of the positioning groove to an outer surface of the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.