Flexible interposer
US12199026B2 · kind B2 · utility
0Cited by
8References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2020 |
| Grant date | Jan 14, 2025 |
| Priority date | — |
| Expiry date | Jan 31, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/185
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An interposer subassembly that is suitable for an electronic system having at least one integrated circuit (1C) component. The interposer subassembly includes a flexible base layer, having a first surface and an opposing second surface, at least one active electronic circuit component, operatively integrated within the flexible base layer, and at least one first patterned contact layer, provided on any one of the first surface and the second surface of the flexible base layer and which is configured to operably interface with the at least one active electronic circuit component and the at least one 1C component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.