Array substrate, method of manufacturing the same, and display device
US12199072B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 5, 2019 |
| Grant date | Jan 14, 2025 |
| Priority date | — |
| Expiry date | May 16, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/882
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An array substrate, a method of manufacturing the array substrate, and a display device are provided. The array substrate includes: a transparent rigid base; light-emitting chips on the transparent rigid base, each light-emitting chip including a chip body and a pin coupled to the chip body, a light-exiting surface of the chip body facing towards the transparent rigid base, and the pin being on a side of the chip body facing away from the transparent rigid base; a driving wire layer on a side of the pin facing away from the transparent rigid base; and a driving chip structure on a side of the driving wire layer facing away from the transparent rigid base. The driving chip structure is coupled to pins of the plurality of light-emitting chips through the driving wire layer, and is used for provide driving signals for the light-emitting chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.