Thermocompression bonding approaches for foil-based metallization of non-metal surfaces of solar cells
US12199201B2 · kind B2 · utility
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Key dates
| Filing date | Jul 13, 2022 |
| Grant date | Jan 14, 2025 |
| Priority date | — |
| Expiry date | Jul 13, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
Abstract
Thermocompression bonding approaches for foil-based metallization of non-metal surfaces of solar cells, and the resulting solar cells, are described. For example, a solar cell includes a substrate and a plurality of alternating N-type and P-type semiconductor regions disposed in or above the substrate. A plurality of conductive contact structures is electrically connected to the plurality of alternating N-type and P-type semiconductor regions. Each conductive contact structure includes a metal foil portion disposed in direct contact with a corresponding one of the alternating N-type and P-type semiconductor regions.
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