Optoelectronic component and method for producing an optoelectronic component

US12199224B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Thomas Reeswinkel · Regensburg, DE
• Jens Eberhard · Lemgo, DE

Key dates

• Filing date: Jan 9, 2020
• Grant date: Jan 14, 2025
• Expiry date: Jan 27, 2042

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/854

Abstract

In an embodiment an optoelectronic component includes a carrier, an optoelectronic semiconductor chip and an encapsulation, wherein the semiconductor chip is fixed on a mounting surface of the carrier and is electrically conductively connected with the carrier, wherein the encapsulation is located around the semiconductor chip and covers the mounting surface at least partially, wherein the encapsulation includes a first layer and a second layer, wherein the first layer is arranged between the mounting surface and the second layer, wherein each of the first layer and the second layer is based on a silicone, and wherein the first layer and the second layer are directly adjacent to each other in a region of an interface.