Display panel, manufacturing method thereof, and bonding structure
US12199228B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Sep 18, 2021 |
| Grant date | Jan 14, 2025 |
| Priority date | — |
| Expiry date | Sep 18, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A display panel, a manufacturing method thereof, and a bonding structure are provided. The display panel includes a first body electrode and a second body electrode disposed on a same layer on a substrate and disposed oppositely. A first conductive electrode is disposed on the first body electrode. A light-emitting device includes a first lead and a second lead disposed opposite to each other. The first lead is disposed to contact the first body electrode and the first conductive electrode. The second lead contacts the second body electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.