Light emitting device package
US12199230B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 11, 2022 |
| Grant date | Jan 14, 2025 |
| Priority date | — |
| Expiry date | Apr 7, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/854
Abstract
A light emitting device package includes a package substrate, a semiconductor light emitting device on the package substrate, the semiconductor light emitting device including a substrate with a light emitting structure, a wavelength conversion portion on the semiconductor light emitting device, the wavelength conversion portion including a first region overlapping the light emitting structure, and a second region other than the first region, an adhesive layer between the semiconductor light emitting device and the wavelength conversion portion, and a reflective resin portion on the package substrate, the reflective resin portion surrounding the semiconductor light emitting device and the wavelength conversion portion, and the reflective resin portion extending to the second region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.