LIDAR sensor system for vehicles including integrated LIDAR chip
US12199401B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2023 |
| Grant date | Jan 14, 2025 |
| Priority date | — |
| Expiry date | Nov 16, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S2301/17
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A LIDAR sensor system for a vehicle includes a silicon photonics substrate. The silicon photonics substrate includes: a semiconductor wafer; one or more surface features on a first surface of the semiconductor wafer; and a photoresist layer formed on the first surface of the semiconductor wafer, wherein the photoresist layer includes a laminated dry film. The silicon photonics substrate can be manufactured by obtaining a semiconductor wafer having one or more surface features; applying a dry film photoresist layer to a first surface of the semiconductor wafer; performing an adhesion bake process on the semiconductor wafer; developing the dry film photoresist layer to produce one or more developed regions in the dry film photoresist layer; and forming one or more solder bumps in the one or more developed regions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.