Microphone package for epoxy overflow protection guard ring in cavity pcb
US12200418B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2019 |
| Grant date | Jan 14, 2025 |
| Priority date | — |
| Expiry date | Apr 5, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/02
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A microphone assembly including an acoustic transducer that generates an electrical signal responsive to acoustic activity, and an integrated circuit electrically coupled to the acoustic transducer and that receives the electrical signal from the acoustic transducer and generate an output signal representative of the acoustic activity. The microphone assembly also includes a substrate comprising a first surface on which the integrated circuit is mounted, a guard ring mounted on the substrate and elevated relative to the first surface of the substrate, and a can mounted to the guard ring, wherein the can, the guard ring, and the substrate form a housing in which the transducer and integrated circuit are disposed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.