Heat sinks for electronic circuits
US12200852B1 · kind B1 · utility
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1References
28Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 24, 2024 |
| Grant date | Jan 14, 2025 |
| Priority date | — |
| Expiry date | May 24, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/066
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat sink apparatus is provided. The heat sink apparatus includes a metal plate that includes a through hole, one or more hollow openings on a first surface of the metal plate, and a recessed groove on the first surface and navigating around the one or more hollow openings. The through hole is used to apply a differential force.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.