Electronic apparatus, cooling module, and heat sink
US12200897B2 · kind B2 · utility
0Cited by
6References
4Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 24, 2022 |
| Grant date | Jan 14, 2025 |
| Priority date | — |
| Expiry date | Aug 1, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/202
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic apparatus includes: a chassis; a heating element; a cooling module having a fan, a heat sink, and a heat transport device, the cooling module being configured to cool the heating element. The heat sink includes: a base plate; a plurality of fins standing from the base plate and placed with a gap between the fins to define an air channel through which air from the air outlet flows; and an inclined plate dividing the air channel in two stages in the standing direction of the fins and being gradually inclined from upstream to downstream of the air channel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.