Structure for evenly applying forces on a heat dissipation base plate
US12200911B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2023 |
| Grant date | Jan 14, 2025 |
| Priority date | — |
| Expiry date | Sep 29, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2023/4087
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A structure for evenly applying forces on a heat dissipation base plate includes a heat dissipation base plate having upper and lower surface, a first threaded hole, and through bores provided at four corners thereof, and being held in place on a heat source by screw fastening elements extended through the through bores for the lower surface to contact with the heat source; a hold-down member disposed on the upper surface of the heat dissipation base plate and having upper and lower side and a second threaded hole extending from the upper to the lower side; and an adjustment element including a screw bolt and a turning knob connected to the screw bolt, the screw bolt being extended through the first and second threaded holes, and turnable by the screw bolt to downward press against and apply evenly distributed forces on a central area of the heat dissipation base plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.