Patent · US Active

Device for heating and determining an actual temperature of a bonding tool of an ultrasonic bonding device

US12202065B2 · kind B2 · utility

0Cited by

6References

12Claims

0Family size

Assignee

Hesse GmbH · US

Inventors

Andreas Unger · Garching bei München, DE
Michael Broekelmann · Delbrück, DE
Matthias Hunstig · Paderborn, DE
Hans-Juergen Hesse · Paderborn, DE

Key dates

Filing date	Mar 10, 2022
Grant date	Jan 21, 2025
Priority date	—
Expiry date	Jul 27, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/78263
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A device for heating and determining the actual temperature of a bonding tool of an ultrasonic bonder, comprising the bending tool, which has a first end face, a second end face, a lateral surface, which connects the first end face to the second end face, and an absorption region, comprising a temperature measuring unit for determining an actual temperature of the bonding tool at a temperature measuring point, which is provided on the lateral surface of the bonding tool and preferably at a tip of the bonding tool, and comprising a laser generator, a laser beam being provided with the aid of the laser generator, and the laser beam striking the bonding tool in the absorption region, and the bonding tool being heated as a result of the absorption of the laser beam.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.