Laser processing apparatus
US12202078B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2021 |
| Grant date | Jan 21, 2025 |
| Priority date | — |
| Expiry date | Aug 8, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/172
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser processing apparatus includes a stage configured to transfer a target substrate and including an opening, an electrostatic chuck disposed on the stage and including a plurality of holes, and a laser irradiation unit disposed above the stage and spaced apart from the stage and configured to irradiate a laser beam on the target substrate. A surface of the electrostatic chuck is in contact with the target substrate, the target substrate includes a plurality of etching regions to be etched by the laser beam and a non-etching region surrounding the plurality of etching regions of the target substrate, and the plurality of holes of the electrostatic chuck overlap the opening of the stage and the plurality of etching regions of the target substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.