System and method for polishing the edge of an electronic device
US12202092B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 20, 2024 |
| Grant date | Jan 21, 2025 |
| Priority date | — |
| Expiry date | May 20, 2044 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B51/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A system for polishing the edge of a mobile device is shown and described. The system includes a robot arm which is configured to grab a mobile device. The robot arm is configured to position the mobile device against at least one polishing wheel of a polishing device using a desired force. The system further includes the use of at least one polishing compound. In some instances, the at least one polishing compound is automatically applied to the at least one polishing wheel. In many of these instances the polishing compound is applied at a specific force and for a specific amount of time, ensuring only a desired amount of compound is applied. The system is contained within a chamber having at least one door configured to allow access to the interior of the chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.