Method for correcting robot
US12202151B2 · kind B2 · utility
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3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 10, 2022 |
| Grant date | Jan 21, 2025 |
| Priority date | — |
| Expiry date | Nov 27, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B2219/50132
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A method for correcting a robot is provided. The method includes: providing a correction device, wherein the correction device comprises a jig wafer; grabbing and/or transferring the jig wafer by using the robot to obtain collected data; determining, based on the collected data, whether the robot needs to be corrected; and in response to that the robot needs to be corrected, obtaining a compensation value according to the collected data, and correcting the robot based on the compensation value.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.