Head, head module, and apparatus that discharges liquid
US12202265B2 · kind B2 · utility
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10Claims
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Assignee
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Key dates
| Filing date | Oct 25, 2022 |
| Grant date | Jan 21, 2025 |
| Priority date | — |
| Expiry date | Feb 9, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/21
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A head includes: a silicon substrate; an insulating film on the silicon substrate; an electrode wiring on the insulating film; a flexible wiring connected to the electrode wiring; and a conductive film electrically connects the flexible wiring and the electrode wiring in a bonding area. The silicon substrate has an exposed area on a surface of the silicon substrate facing the insulating film, and the exposed area is in a vicinity of the bonding area and is exposed from the insulating film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.