Thermally conductive silicone potting composition
US12202975B2 · kind B2 · utility
0Cited by
6References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 8, 2021 |
| Grant date | Jan 21, 2025 |
| Priority date | — |
| Expiry date | Jul 6, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/3737
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides a thermally conductive silicone potting composition. In one embodiment the thermally conductive silicone potting composition comprises:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.