Electronic device, light emitting device and method for manufacturing an electronic device
US12203644B2 · kind B2 · utility
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20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 13, 2021 |
| Grant date | Jan 21, 2025 |
| Priority date | — |
| Expiry date | Aug 13, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0365
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electronic device includes a heat dissipation structure that includes one or more openings. An electronic component is disposed on a surface of the heat dissipation structure and over the one or more openings. The electronic component is coupled to the heat dissipation structure by an adhesion material in the one or more openings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.