Electronic device including heat dissipation structure
US12204384B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 20, 2022 |
| Grant date | Jan 21, 2025 |
| Priority date | — |
| Expiry date | Dec 3, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K5/0018
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
According to various embodiments of the disclosure, an electronic device may include: a housing, a display accommodated inside the housing, a support supporting the display and including a opening and a side wall surrounding the opening, and a heat dissipation structure at least a portion of which is positioned in the opening and bonded to the side wall, wherein the heat dissipation structure may include a heat dissipation layer having a first thermal conductivity and a protective layer having a second thermal conductivity, is the second thermal conductivity being lower than the first thermal conductivity, the protective layer covering at least a portion of the heat dissipation layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.