Light emitting element package including substrate with edge notch and display device including light emitting element package
US12206059B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 7, 2022 |
| Grant date | Jan 21, 2025 |
| Priority date | — |
| Expiry date | Jan 11, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light emitting element package includes a first substrate, at least one light emitting element, an encapsulation layer, and a plurality of conductive pads. The first substrate has an upper surface and a lower surface opposite to each other, in which an edge of the lower surface has a notch. The at least one light emitting element is disposed on the upper surface of the first substrate, in which the light emitting element has a positive electrode and a negative electrode. The encapsulation layer covers the light emitting element. The plurality of conductive pads are disposed on the lower surface of the first substrate and electrically connected to the positive electrode and the negative electrode of the light emitting element, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.