Beveled overburden for vias and method of making the same
US12207405B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2021 |
| Grant date | Jan 21, 2025 |
| Priority date | — |
| Expiry date | Sep 29, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1476
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate including a via with a beveled overburden is disclosed. The substrate can include a substrate having a first surface, a second surface opposite the first surface, and a via passing from the first surface to the second surface. The via can be coated with a metallic layer that includes a first beveled overburden on the first surface, and the first beveled overburden can include a first outer edge that forms a first bevel angle greater than 95° with the first surface. The substrate can include a second beveled overburden that includes a second outer edge that forms a second bevel angle greater than 95° with the second surface. Methods of making the beveled overburdens are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.