Managing unwanted heat, mechanical stresses and EMI in electrical connectors and printed circuit boards
US12207430B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 7, 2021 |
| Grant date | Jan 21, 2025 |
| Priority date | — |
| Expiry date | Oct 3, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/28
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A substrate reinforcement or stiffener can be toolless, slide-on, slide-off, and removable. A hold down can carry pre-attached solder balls, solder units, or fusible elements. Fusible elements can be shaped to reduce thermal and mechanical stresses when reflowed onto a substrate. A heat-producing article can include a heat-dissipation material selectively located on, or immediately adjacent to, a heat-producing article. Clips with a plurality of fingers can be added to power conductors. Graphene strips, graphene coatings, or nanomaterials can be applied to electrically non-conductive articles and are able to selectively direct unwanted heat away from the heat-producing article. Electro-magnetic interference can be reduced by selective placement of voids in a shield of an electrical component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.