Two-phase immersion-type composite heat dissipation device
US12207445B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 16, 2023 |
| Grant date | Jan 21, 2025 |
| Priority date | — |
| Expiry date | Oct 5, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20809
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A two-phase immersion-type composite heat dissipation device is provided, which includes a heat dissipation substrate, a plurality of fins, and a surface porous layer. The heat dissipation substrate has a first surface and a second surface. The first surface is configured to be in contact with a heat source, and the second surface is opposite to the first surface and is distant from the heat source. A projection region of the heat dissipation substrate that corresponds to the heat source is defined as a high-temperature region, and a low-temperature region is defined at an outer periphery of the high-temperature region. The fins are opposite to the heat source, and are disposed within the high-temperature region of the second surface of the heat dissipation substrate. The surface porous layer is disposed within a range of the low-temperature region of the heat dissipation substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.