Fabrication method for superconducting circuit and superconducting quantum chip

US12207568B2 · kind B2 · utility

Assignee

• Origin Quantum Computing Technology (Hefei) Co., Ltd · CN

Inventors

• Liangliang Ma · Beijing, CN
• Bing Cheng You · Hefei, CN
• Nianci WANG · Hefei, CN
• Jie Zheng · Dalian, CN
• Wenshu LIU · Hefei, CN

Key dates

• Filing date: May 10, 2023
• Grant date: Jan 21, 2025
• Expiry date: May 23, 2043

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10N69/00

Abstract

Disclosed are a fabrication method for a superconducting circuit and a superconducting quantum chip. The fabrication method includes: determining, on a substrate, a first junction region located between a first electrical element and a second electrical element, and a second junction region located between a first conductive plate and a second conductive plate that are formed in advance; forming a Josephson junction in the second junction region; detect an electrical parameter of the Josephson junction, and determining whether the electrical parameter is within a target parameter range; if yes, separating the Josephson junction through cutting, and moving the Josephson junction to the first junction region; and forming a first connection structure connecting the first superconducting layer to the first electrical element and a second connection structure connecting the second superconducting layer to the second electrical element.