Powder material for use in additive layer manufacturing, additive layer manufacturing method using same, and molded article
US12208446B2 · kind B2 · utility
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5Claims
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Key dates
| Filing date | Nov 8, 2019 |
| Grant date | Jan 28, 2025 |
| Priority date | — |
| Expiry date | Nov 5, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12014
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
There is provided a powder material that is for densifying a molded article manufactured by an additive layer manufacturing method and improving harness of the molded article. There is provided a powder material for use in additive layer manufacturing containing ceramics and metals, in which a tapped filling rate defined by (tapped density/theoretical density)×100% is 40% or more.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.